User Design Track
Final date of submission: 20th September 7th October, 2024 Closed
Notification for Acceptance: 30th November, 2024
Final Presentation Submission: 7th December, 2024
Enquiries: Contact us
Final date of submission: 20th September 7th October, 2024 Closed
Notification for Acceptance:
30th November, 2024
Final Presentation Submission:
7th December, 2024
Enquiries: Contact us
Artificial Intelligence (AI) has permeated every facet of our lives. AI advancements through sustainable innovations in accelerated computing, secure connectivity, and intelligent mobility have revolutionized the electronics industry. This evolution has propelled growth across diverse fields of smart automotive, secure homes, healthcare, robust connectivity, and efficient manufacturing. Within the realm of VLSI and Embedded Systems, the focus has shifted toward accelerated computing, sensing, wireless connectivity, big data, secure connectivity and data conversion. To support this evolution, significant advancement has been observed in EDA/CAD automation, design and manufacturing, and Quantum Computing. Notably, the semiconductor industry remains pivotal in enabling these transformative technologies. VLSID 2025 conference provides a platform for researchers and practitioners to explore how VLSI and Embedded Systems can drive disruptive advancements for the next generation.
The User Design Track provides a unique platform to showcase cutting-edge work that is happening in the industry to a wide audience. The unique slides-only format for UDT allows for simplified and faster preparation for submission. The UDT committee invites high-quality submissions targeting challenges, innovations, WIP, late breaking results on the wide range of topics including but not limited to:
Topics:
- Hardware for Machine Learning and Artificial Intelligence
- Analog & Mixed Signal and, RF Circuits
- Sensors interfacing circuits and systems
- VLSI for Automotive Circuits and Systems
- Test, Verification and Reliability
- Embedded Systems, Internet of Things (IoT), and Cyber-Physical System Design
- Electronic Design Automation
- Low power Digital Systems
- Advances in CAD for VLSI
- Latest trends in device design and modeling
- Beyond 2D in Packaging and interconnects
- Hardware and Systems Security
- Emerging Memory Technologies
- Advanced process and Material
- Photonic Integrated Circuits and Optical Communication
- Wireless Systems, 5G and beyond
- Power & Energy Management
- Emerging Computing & Post-CMOS Technologies
- Quantum Computing
- FPGA Architecture Design – Layout Design, Open FPGA
- Neuromorphic Computing – Spiking Neural Networks, Neuron models
- Chiplets based heterogeneous designs
Submission Guidelines:
- Submissions must be made electronically before the due date.
- Submissions must be in PDF format and use the provided presentation template.
- Submissions must be limited to 10 total slides (including title slide, references/acknowledgement slide).
- Authors names & affiliations must NOT be included in the presentation while submitting.
- Presentation should clearly state the Problem Statement/Motivation, Proposed Solution, Novelty elements, Evidence, Applications, Silicon results, Future work.
- Authors can use speaker notes to provide additional details to the reviewers wherever required.
- Submissions will undergo a double-blind review. Submissions exceeding the slide limit or identifying the authors/affiliation will be rejected without review.
- At least one author from every accepted submission MUST register and present at the conference.
- Authors will also need to submit recorded video of the presentation.
Please refer the brochure for details.