Important Dates:

✓ Deadline for Full Paper Submission : 26-Sep-21  31-Oct-21
✓ Notification for Acceptance  : 11-Dec-21  18-Dec-21
✓ Deadline for Submission of Camera-ready Paper : 16-Jan-22  23-Jan-22
✓ Conference : 19 to 23 Feb 2022

Please Note:

All Regular papers must be in PDF format only, with save-able text.

  • Each paper must be no more than 6 pages (including the abstract, figures, tables, and references), double-columned in IEEE Format

  • Your submission must not include information that serves to identify the authors of the manuscript, such as name(s) or affiliation(s) of the author(s), anywhere in the manuscript, abstract, or in the embedded PDF data. References and bibliographic citations to the author(s) own published works or affiliations should be made in the third person.

  • Submissions not adhering to these rules, or determined to be previously published or simultaneously submitted to another conference, or journal, will be summarily rejected.

  • The TPC Chairs reserve the right to finally reject any manuscripts not adhering to these rules.

Important: Final camera-ready versions must be identical to the submitted papers with the following exceptions; inclusion of author names/affiliation, correction of identified errors, addressing reviewer-demanded changes. No other modifications of any kind are allowed including modification of title, change of the author list, reformatting, restyling, rephrasing, removing figures/results/text, etc.

For questions Contant: [email protected]

CFP Topics

Artificial Intelligence, Machine Learning and their Applications

AI Accelerators, Edge Computing, Approximate Computing, Autonomous Intelligence (ADAS), AI ethics

Security and Safety

Functional Safety, Privacy, Cryptography, PUFs, TRNGs, Hardware Trojans, Trusted Computing, Network Security, Side-Channel and Fault Analysis and Countermeasures

Analog and Mixed Signal Design

Analog Circuits for Various Applications, Data Converters, High Speed Interfaces, Power Management Circuits, Energy Harvesting Circuits & Systems, Circuits & Systems for AI-oriented Applications

Sensors Circuits and Systems

Sensor Interfacing, Instrumentation, Biomedical Circuits and Healthcare Systems, Low Noise Circuits, EMI Immune Design, Autocalibration Techniques, Wearable Electronics, Autonomous Sensors Systems

Digital Integrated Circuits and Systems

Digital Circuits for Communication, Arithmetic Circuits, System-on-Chip Design, Network-on-Chip Design, Low-power Logic Design

Power Electronics

High Power Circuits, Power Convertors, Power Optimization Techniques, Power Delivery Networks, Power Switches, High Voltage Circuits and Systems, Power Management for High Voltage Applications, Power Amplifiers

Emerging Technologies and Devices

Quantum Computing, Neuromorphic Computing, Synaptic Devices, CMOS Technology and Devices, New Age Nano-Electronics, MEMS Devices, GaN and SiC Devices

RF Circuits and Systems

Transceiver Architectures, Short-Range Communication, IoT/IoE, WPAN, Ultra-Low Power Wireless Designs, Effective Spectrum Utilization, RF Power Amplifiers, RF Energy Harvesting

Embedded System Design

IoT Systems, Cyber-Physical Systems, Hardware/Software Co-design, Embedded Software, Embedded Operating Systems

Test and Reliability

EMIR, Interconnect, Power Integrity-Signal Integrity (PISI), EMI/EMC Compatibility, Built-in Self-Test, Design for Test, Self-X (Awareness, Repair, Test), On-line Test, Fault Tolerance

Electronic Design Automation

Verification, Synthesis, Physical Design, Silicon Engineering, Just-in-time Synthesis, AI enabled algorithms, Formal Verification, Optimization

Architectures

Chip Architecture, Computer Architecture, High Performance Computing, Configurable Computing, (Embedded) FPGA, Memory Subsystems, In Memory Computing Systems

Packaging and Interconnects

On-chip interconnects, 3D packaging, Wafer-level packaging, Interconnect Technologies

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