Design Contest

Title Authors
TEAM-1: Hardware software co-design to accelerate brain tumor segmentation and classification Vinay Rayapati
Gogireddy Ravi Kiran Reddy
Sanampudi Gopala Krishna Reddy
Gandi Ajay Kumar
Nanditha Rao
IIIT Bangalore
TEAM-5: Design and performance analysis of deep-learning augmented channel estimation on System-On-Chip Syed Asrar Ul Haq
Animesh Sharma
Anurag Gulati

Important Dates

โœ“ Idea Submission:
Closed ๐Ÿ“…
โœ“ Acceptance Notification:
โœ“ Kit distribution:
closed ๐Ÿ“…
โœ“ Idea Presentation & Demo:
Jan 11, 2023 ๐Ÿ“…

โœ“ Idea Submission: Closedย ๐Ÿ“…
โœ“ Acceptance Notification: Closedย ๐Ÿ“…
โœ“ Kit distribution: Closedย ๐Ÿ“…
โœ“ Idea Presentation & Demo: Jan 11, 2023 ๐Ÿ“…

FAQs for accepted submissions

Design Contest - Process

The 36th International Conference on VLSI Design and the 22nd International Conference on Embedded systems is holding the International Design Contest to provide a platform to showcase semiconductors driving disruptive innovations in global digitalization.

Theme of the Contest

The theme of the Design Contest is Hardware and Embedded software co-design with hardware acceleration in an SoC FPGA. You will be showcasing design approaches and system solutions in the areas/domains of AI/ML, IoT, Factory & Industrial Automation, Automotive, Medical, Environment & Clean Energy

Hardware Platform

The hardware platform will be Microchip Technologyโ€™s RISC-V based PolarFireยฎ SoC Icicle Kit. For details on the kit, please refer to the following external links:

PolarFire SoC Icicle Kit Hardware Kit:

Stage-1 : Idea Submission

  • Your idea submission should cover a description of the idea along with a block diagram of your idea
  • Examples of itโ€™s application
  • Benefits and value addition of your solution
  • Your team description along with your contact information with mailing address

ย Steps for the submission

  • Download template available on the Conference website.
  • Fill all required details with minimum font size: 10pt, Times New Roman font. Max two pages including tables, diagram, references (if any).
  • Convert it to pdf format.

Submit the pdf using the weblink available on Conference website.

Following the first round of screening, teams will be shortlisted to convert their ideas into application solution using the PolarFire SoC Icicle Kit. Hardware kits will be shipped to the selected teams.

Stage-2 : Implementation

  • Implementation should be on the Microchip Technology PolarFire SoC Icicle Kit provided.
  • Experts from Conference team will guide and mentor during this 2 months of implementation.


  • Top 2 innovative designs will be considered for exciting awards

For questions contact: [email protected]

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